| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a method for manufacturing an IC socket, capable of conducting an electrical function test, without requiring a test socket required corresponding to the number of pins and dimension of an IC package or a transfer machine or the like for divided IC packages. <P>SOLUTION: The method comprises a resin seal forming step for forming a resin seal, by sealing a wired IC chip and lead frames after wiring terminals and lead parts of the lead frames of the IC chip, after mounting the IC chip to a plurality of frame die pads of the lead frames having lead parts for connecting between a plurality of frame die pads and a plurality of frame die pads; a lead removal step for cutting and removing leads extending outside from each block, one IC package, of the resin seal, a test step for testing an electrical function of every block as resin seal, and a cutting step for cutting the resin seal by the block. <P>COPYRIGHT: (C)2004,JPO |
