发明名称 COIL DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a coil device which can be easily fitted to limited space without requiring fitting space. SOLUTION: An adhesive layer 18 is formed on a substrate 19. A first insulating film 16 is formed on the adhesive layer 18. A plurality of first linear conductors 14b are formed on the first insulating film 16 in parallel so as to be mutually separated, an insulating layer 13 is formed on the conductors 14b, and a rectangular flexible sheet-like magnetic substance 11 is laminated on the surface of the insulating layer 13. A plurality of second linear conductors 14a are formed on the magnetic substance 11 through an insulating layer 12 in parallel so as to be mutually separated. The ends of the first and second linear conductors 14b, 14a are electrically connected to each other through through-holes to form a coil 14 wound around the sheet-like magnetic substance 11 which is a winding core. A second insulating film 15 is formed on the second linear conductors 14a. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004055973(A) 申请公布日期 2004.02.19
申请号 JP20020213917 申请日期 2002.07.23
申请人 KEISOKU KENKYUSHO:KK;ROYAL KIKI KK 发明人 UTAKA MASATOSHI;TSUBOI KIYOSHI;SUGAWARA TSUNEO;YUASA HAJIME
分类号 H01F41/04;H01F17/00;H01F17/04;(IPC1-7):H01F17/00 主分类号 H01F41/04
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