| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin-piece type resin coat carrier used for a printed circuit board which prevents a resin from protruding out when pressed and brought into contact with the printed circuit board. SOLUTION: The resin coat carrier 10 is arranged on the printed circuit board made principally of an insulating material. The carrier 10 has a piece type body 11 which is resin coat copper foil and shaped in conformity with the printed circuit board. The chip-sized body 11 has a joined surface 12 joined with the end surface of the printed circuit board, and a resin 19 which is laid flatly on the chip-sized body 11 is shaped on the joined surface 12 in conformity with the printed circuit board with a size a little smaller than the body 11. When the chip-sized body 11 is stuck on the printed circuit board, the area where the resin 19 is provided is covered with the printed circuit board. COPYRIGHT: (C)2004,JPO
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