INTERLAYER CONNECTION METHOD OF CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To prevent connecting locations from being limited by enabling soldering of connecting pins and upper layer circuit board to be performed by means of reflow solder and print of cream solder. SOLUTION: Connecting pins 14 are stood in the connecting locations of a lower layer circuit board 10 with an upper layer circuit board, and a printing table 16 is formed on the lower circuit board 10, where connecting pins 14 are stood so that upper ends of the connecting pins 14 are exposed from an upper surface of the printing table. Cream solder 20 is printed so as to contact the connecting pins 14 on the upper surface of the printing table 16 and the upper layer circuit board 12 is put on the printing table 16. Thereafter, heat is applied to solder connecting pins 14 with the upper layer circuit board 12 and then the printing table 16 is removed. COPYRIGHT: (C)2004,JPO