| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high frequency superimposing module having such a constitution that the efficiency is improved and the increase of Q value is attained accompanying by that the requirement for thickness reduction is complied with as well as for the miniaturization. <P>SOLUTION: An inductor L6 which is a passive element for resonance of an oscillating circuit part, is constituted by laminating dielectrics 50 having the low dielectric constant and conductors. Capacitors C7, C8 which are the passive elements for resonance of the oscillating circuit part, and capacitors C9, C10 of an impedance matching circuit are constituted by laminating dielectrics 51 having the high dielectric constant and the conductors. <P>COPYRIGHT: (C)2004,JPO |
