| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of packaging a decoupling capacitor in the vicinity which is within a shortest distance from a semiconductor integrated circuit element, without the use of an interposer structure. <P>SOLUTION: The semiconductor device comprises a support substrate 1, the semiconductor integrated circuit element 2 packaged on the support substrate, and a thin-film capacitor 20 capable of stably operating the semiconductor integrated circuit element in high frequency ranges. The thin-film capacitor 20 is electrically connected to an electrode pad beneath the lower surface of the semiconductor integrated circuit element 2, and the thickness of the thin film capacitor 20, including the substrate thickness on the support substrate 1, is smaller than the height of the bumps. <P>COPYRIGHT: (C)2004,JPO |
