发明名称 MOLDING FIXTURE, MOLDING EQUIPMENT AND MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a molding fixture which prevents the generation of burrs and the leakage of a sealing compound from occurring, molding equipment and a molding method. SOLUTION: The molding fixture 100 is a ring-like member and constituted of an inner peripheral member 101 and an outer peripheral member 102. The inner peripheral member 101 has a circumference long enough to encircle the periphery of a semiconductor wafer. The outer peripheral member 102 has a height equal to or less than the height or below of the inner peripheral member 101 and is formed so as to encircle the periphery of the inner peripheral member 101. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004050497(A) 申请公布日期 2004.02.19
申请号 JP20020208434 申请日期 2002.07.17
申请人 SHINKO ELECTRIC IND CO LTD 发明人 YAMASHITA YOSUKE;KOBAYASHI SHOICHI
分类号 B29C43/36;B29C39/10;B29K105/22;B29L31/34;(IPC1-7):B29C43/36 主分类号 B29C43/36
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