| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board that can form fine wires by a subtractive method. SOLUTION: In the method for manufacturing the wiring board which forms a resist pattern on a cconductor layer on an insulating layer and forms wires by wet etching, the surface free energy of the patterned resist is so determined that 0.1 <γp< 5.0 mn/m or 0.1 <γh < 10.0 mN/m (γp is a bipolar interacting component of the surface free energy, andγh is a hydrogen coupling component). Namely, loweringγp andγh concerned with a hydrophilic component of the surface free energy of the resist pattern suppresses permeation of an etchant from the interface between the conductor layer and resist and then fine wires can be formed. COPYRIGHT: (C)2004,JPO
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