| 摘要 |
PROBLEM TO BE SOLVED: To provide a lid for sealing an electronic component package, which uses a low-cost brazing material, seals the electronic component package while the electronic component package is less thermally distorted and is high in reliability, without occurrence of metal whiskers and metal migration. SOLUTION: A copper alloy plating film, containing about 50% copper and having a melting point of 700°C or below, is formed as thick as 2 to 6μm on over the entire surface of a lid body, formed of single metal or alloy for the formation of the lid for sealing the electronic component package. The copper alloy plating film is formed of a binary alloy of copper and tin or a ternary alloy of copper, tin, and zinc. COPYRIGHT: (C)2004,JPO
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