| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a low-cost electrode and wiring capable of easily forming minute electrode and wiring patterns even if an aqueous solution easy to handle, and imposing a small load on the environment is used, and of controlling a sheet resistance value in an arbitrary range according to a request of a device without requiring a large process change. SOLUTION: This method comprises: a process for forming a pattern on a surface of a board; an absorption process for making the pattern part absorb metal compounds; and a process for baking the part that has absorbed the metal compounds. The method is characterized by that the absorption process comprises processes for first making the pattern part absorb a first metal compound, and successively making it absorb a second metal compound. COPYRIGHT: (C)2004,JPO
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