发明名称 |
Methods for application of adhesive tape to semiconductor devices |
摘要 |
A first adhesively coated tape material length is supplied to a first die associated with a cutting and application mechanism. A second length of adhesively coated tape material is also provided to a second die of the cutting and application mechanism. A plurality of LOC leadframes is supplied sequentially through the application structure to apply a first decal cut from the first tape material to a first die site at a first location and to apply a second decal cut from the second tape material to a second die site at a second location. |
申请公布号 |
US2004033642(A1) |
申请公布日期 |
2004.02.19 |
申请号 |
US20030639124 |
申请日期 |
2003.08.11 |
申请人 |
CHAPMAN GREGORY M. |
发明人 |
CHAPMAN GREGORY M. |
分类号 |
H01L21/00;H01L23/495;(IPC1-7):H01L21/48;H01L21/44;H01L21/50 |
主分类号 |
H01L21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|