PIEZOELECTRIC DEVICE, PACKAGE FOR PIEZOELECTRIC DEVICE, MANUFACTURE OF PIEZOELECTRIC DEVICE, MOBILE TELEPHONE EQUIPMENT UTILIZING PIEZOELECTRIC DEVICE AND ELECTRONIC EQUIPMENT UTILIZING PIEZOELECTRIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a piezoelectric device, a method of manufacturing the same and a package for the piezoelectric device imposing no danger of damaging a structure within a package of a piezoelectric vibrator chip or the like and reliably sealing holes. SOLUTION: The piezoelectric device which houses a piezoelectric vibrator chip 32 in a package 36 has substrates composed of a plurality of laminated insulating materials. The substrates are a first substrate 61 which forms a bottom portion exposed to the outside and a second substrate 64 laminated on the first substrate. The piezoelectric device has a first hole 37 which is formed on the first substrate and opened to the outside and a second hole 42a which is formed on the second substrate, opened to the housing space and has an opening area larger than the first hole. In the first hole and the second hole, only the circumferential edge of the second hole is communicated, part of the first hole is closed with the second substrate to form a shield part 62, and the first hole is filled with metal sealing 38. COPYRIGHT: (C)2004,JPO