| 摘要 |
<p>In a substrate (15) such as a printed circuit board having optical wave guides (11, 7, 9) in its surface layers a mirror structure (17) is directly attached to a plate (1) and has a reflective, tilted surface (25). The mirror structure projects from an inner portion of the surface of the plate into a recess (13) in the substrate surface, the recess being made in the optical waveguide. The reflective surface thereby deflects light travelling in the waveguide. It can deflect light issued from the plate, in the case where the plate is e.g. a laser chip, to be injected into the waveguide. The reflective surface can also deflect light travelling in the waveguide to be received by the plate in the case where the plate has a photodetecting capability. The plate, e.g. a semiconductor chip, can be surface mounted to the substrate. For that purpose the plate has solder pads (21) cooperating with solder bumps (19) and such mounting can give the plate a very accurate position at the substrate surface. The plate can also be a dummy plate acting only as a carrier of the mirror structure that then can contain a plurality of reflecting surfaces placed on top of each other for deflecting light from one level of optical waveguides to another level and thus acts as an optical via.</p> |
