发明名称 |
A SEMICONDUCTOR MANUFACTURING APPARATUS HAVING A BUILT-IN INSPECTION APPARATUS AND METHOD THEREFOR |
摘要 |
According to the present invention, a chemical and mechanical polishing apparatus (100) for a sample such as a wafer includes a built-in inspection apparatus (25) incorporated therein. The polishing apparatus (100) further comprises a load unit (21), a chemical and mechanical polishing unit (22), a cleaning unit (23), a drying unit (24) and an unload unit (26). The chemical and mechanical polishing apparatus (100) receives a sample from a preceding step (107), carries out respective processes for the sample by said respective units disposed within the polishing apparatus (100) and then transfers the processed sample to a subsequent step (109). Sample loading and unloading means and a sample transfer means are no more necessary for transferring the sample between respective units. |
申请公布号 |
WO03038858(A8) |
申请公布日期 |
2004.02.19 |
申请号 |
WO2002JP11450 |
申请日期 |
2002.11.01 |
申请人 |
EBARA CORPORATION;SATAKE, TOHRU;NOJI, NOBUHARU |
发明人 |
SATAKE, TOHRU;NOJI, NOBUHARU |
分类号 |
H01L21/66;B24B37/04;G03F7/20;H01J37/18;H01J37/28;H01J37/29;H01L21/00;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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