| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a coating treatment apparatus and a coating treatment method that can uniformly apply a coating liquid, even to a substrate such as a wafer having a large aperture without spots. <P>SOLUTION: A coating liquid discharge nozzle 60 is mounted to a nozzle holder 61, while being freely rockable. The coating liquid discharge nozzle 60 can be reciprocally rocked by a rocking drive section. A spin chuck 50 that retains the wafer W for rotating is provided. Then, the coating liquid discharge nozzle 60 is moved to the upper section of the center section of the wafer W on the spin chuck 50. The wafer W is rotated at a low speed. The coating liquid discharge nozzle 60 is reciprocally rocked, and at the same time, discharges the coating liquid to the wafer W. As a result, the coating liquid is supplied to a circular region, with the center section of the wafer W as the center. After that, the wafer W is rotated at a high speed, and the coating liquid on the wafer W is spread to the entire surface of the wafer W. First, the coating liquid is supplied to the circular region, and coating spots occurring in diffusion are restrained. <P>COPYRIGHT: (C)2004,JPO |
