发明名称 SYSTEM AND METHOD FOR FORMING WIRING
摘要 PROBLEM TO BE SOLVED: To realize a highly precise system and a method of forming wiring, capable of easily and speedily performing design, inspection, and formation of wiring, capable of reducing the cost required for forming and designing the wiring, capable of forming ultrafine wiring, and capable of flexibly responding to design change. SOLUTION: The system 1 for forming wiring is provided with a maskless exposure means 11 that directly exposes a pre-exposure substrate using exposure data generated based on design data relevant to a wiring substrate; a post-development inspection means 12 that inspects a post-development substrate using the exposure data and image data of the post-development substrate that is exposed by the maskless exposure means 11 and is developed; an etching means 13 that etches the post-development substrate; and a post-etching inspection means 14 that inspects the etched pattern formed on the post-etching substrate using etching inspection data generated based on the design data and the image data of the post-etching substrate that is etched by the etching means 13. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004056068(A) 申请公布日期 2004.02.19
申请号 JP20020360774 申请日期 2002.12.12
申请人 SHINKO ELECTRIC IND CO LTD 发明人 AKAGAWA MASATOSHI;SEKIKAWA KAZUNARI;WAKABAYASHI SHINICHI
分类号 G01N21/956;G03F7/207;G03F9/00;H01L23/12;H05K1/02;H05K3/00;H05K3/06;H05K3/10;H05K3/12;H05K3/46;(IPC1-7):H05K3/00 主分类号 G01N21/956
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