| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of wiring boards for reducing the resistance between wiring layers in respective layers. <P>SOLUTION: In the method a hole 4 is provided on a resin plate 1, whose both surfaces have copper foils 2, 3; temporary curing is made by filling the hole 4 with a silver paste 5, where silver particles that have a radial projection and are mutually fitted and connected for forming a conductive path are mixed with a binder made of an epoxy resin and dispersed; the copper foils 2, 3 are selectively etched for forming the wiring layer 6; a wiring substrate 7 is formed; a hole 12 is provided on a second resin plate 11; and temporary curing is made by filling the hole 12 with the silver paste 13, where the silver particles having the radial projection are mixed with the binder made of the epoxy resin for dispersing. Additionally, the surface of the silver paste 13 is flattened by polishing; a connection substrate 14 is formed; the wiring substrate 7 and the connection substrate 14 are alternately laminated by allowing the end face of the silver paste 5 to come into contact with that of the silver paste 13 for pressurizing from both sides and at the same time, a wiring substrate 8 and the connection substrate 14 are subjected to thermocompression bonding; and the silver pastes 5, 13 are cured. <P>COPYRIGHT: (C)2004,JPO</p> |
