| 摘要 |
PROBLEM TO BE SOLVED: To provide an equipment and a mold for sealing with resin which seal an object to be sealed such as a thin type semiconductor substrate in a high grade by reducing or removing the air staying between the object to be sealed and a bottom force. SOLUTION: The equipment for sealing with resin, in which a sealing space is defined by the mold composed of a top force and the bottom force, and which has a sucking means which sucks the sealing object onto the mold and fixes it and a sealing means which introduces the sealing resin into the sealing space and seals the sealing object with the resin, is characterized in that the mold has an exhaust hole formed for exhausting the air remaining between the sealing object and the mold that sucks and fixes the object. COPYRIGHT: (C)2004,JPO |
