发明名称 METHOD OF MANUFACTURING LAMINATED CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing laminated ceramic electronic component, which will not easily generate delamination, assures proper moisture resistance, and does not easily generate a structural defect such as delamination and crack, even when the number of times of lamination processes of internal electrode increases, and thereby the ceramic layer between the internal electrodes becomes thin. SOLUTION: The method of manufacturing a laminated layer ceramic electronic component comprises the following steps. Namely, a laminate is obtained by laminating a plurality of sheets of ceramic green sheets 6 on an elastic sheet 2, while pressure is applied at least to a sheet of ceramic green sheet 6, on which a conductive paste is printed at the time of manufacturing the laminated layer ceramic electronic component, including a ceramic sintered body obtained by laminating the ceramic green sheets on which the conductive paste 5 is printed and then sintering these ceramic green sheets. On the elastic material sheet 2, the laminate obtained is pressurized in the laminating direction, the ceramic green sheets are pressurized with each other. Next, the laminate is sintered to obtained the ceramic sintered body. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004055678(A) 申请公布日期 2004.02.19
申请号 JP20020208591 申请日期 2002.07.17
申请人 MURATA MFG CO LTD 发明人 UENO YASUSHI;KOIZUMI NOBUYUKI;TAIRA HIROAKI
分类号 H01G4/30;(IPC1-7):H01G4/30 主分类号 H01G4/30
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