发明名称 BUFFER MATERIAL FOR PACKAGING
摘要 PROBLEM TO BE SOLVED: To provide a buffer material for packaging easily formed by use of a minimum number of raw materials and showing an excellent load resistance. SOLUTION: In the buffer material for packaging formed of a buffer material A26 and keeping clearance between a lower surface and four side surfaces of a product 33 to be packaged and an inner surface of a packaging box 36, the buffer material A26 is made of a sheet of a corrugated fiberboard A1, rectangular sleeves a16 and b17 each having an approximately rectangular cross section are arranged in both the side portions, U-shaped sleeves a20 and b21 each having a U-shaped cross section are arranged perpendicularly to the rectangular sleeves a16 and b17, and upper portions of both the ends of the rectangular sleeves a16 and b17 are locked with the upper portions of both the ends of the U-shaped sleeves a20 and b21. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004051202(A) 申请公布日期 2004.02.19
申请号 JP20020214744 申请日期 2002.07.24
申请人 HITACHI HOMETEC LTD 发明人 HAGIOKA HIROYOSHI
分类号 B65D85/68;B65D81/113;(IPC1-7):B65D81/113 主分类号 B65D85/68
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