Semiconductor element for wafer level and chip scale packaging has housing joined to chip by only an adhesive layer and contacts directly connected to the plate

摘要

A semiconductor element (1) for mounting on a conductor plate comprises a chip (3) with a housing (4) and electrical contacts (5) directly to the plate. The housing is only glued to the chip and has a protective cover (8) and frame (9) which does not touch the chip but mechanically supports the housing on the plate.