| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor module device, wherein dimples do not exist between surfaces of a plurality of semiconductor chips and a resin surface, and wiring can be performed properly to mutual electrodes between prescribed semiconductor chips, and to provide a method for manufacturing the semiconductor module device. SOLUTION: In the semiconductor module device 10, a plurality of semiconductor chips Sa, Sb, etc. are arranged by a prescribed arrangement. The electrode surfaces of the semiconductor chips Sa, Sb, etc. are exposed. Parts between the plurality of adjacent semiconductor chips Sa, Sb, etc. are filled with resin 15, forming the same surface as the electrode surfaces. Electrodes between prescribed semiconductor chips Sa, Sb, etc. are wired with one other, and the backsides of the whole of the plurality of semiconductor chips Sa, Sb, etc. are coated with the resin 15, so that the semiconductor module device 10 is constituted. COPYRIGHT: (C)2004,JPO |
