METHOD OF AND APPARATUS FOR QUANTITATIVELY INSPECTING QUALITY OF SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method of and an apparatus for quantitatively inspecting the quality of a substrate such as a wafer. SOLUTION: The method of quantitatively evaluating the substrate such as a wafer defines a plurality of continuous first regions such that each first region overlaps an adjacent first region. A normal vector representing fluctuations of the thicknesses of the first regions using the thickness data of each first region. Next, an angle difference between the normal vectors for each combination of two adjacent first regions is determined. Thereafter, the determined angle difference is compared to a reference value to evaluate the quality of a second region including at least one first region. COPYRIGHT: (C)2004,JPO