| 摘要 |
Polishing pads with a window, systems containing such polishing pads, and processes that use such polishing pads are disclosed. For example, a light beam (34) having a wavelength between about 300 and 500 nm may be directed through a transparent portion (44) of a polishing surface of a polishing pad (18) during polishing in one of a shallow trench isolation (STI) fabrication process, a spin-on glass fabrication process and a silicon-on-insulator (SOI) fabrication process. As another example, the polishing pad may include a backing layer (116), a polishing layer (120), a solid window (140), and layers of first and second different adhesive materials (150, 160) between the backing layer and the solid window. |
