| 摘要 |
<P>PROBLEM TO BE SOLVED: To efficiently radiate the heat generated by the operation of an optical semiconductor element constituted of an emission element or/and a reception element or the like, and to contribute to the miniaturization of an optical semiconductor device. <P>SOLUTION: The optical semiconductor device 100 for an optical pickup device which writes predetermined information in an optical disk and/or reads the information written in the optical disk is provided with an optical semiconductor element 1 constituted of an emission element and/or a reception element, a diepad section 10 for supporting the optical semiconductor element, a resin package 3 for sealing the optical semiconductor element 1 supported by the diepad section 10, a mold resin PKG 4, and a transparent resin 6 on which an HOE pattern is printed. Parts 10A and 10B exposed from the resin package 3 of the diepad section 10 are bent about 90° so as to be set along the inner surface of an OP slide base 50 for supporting the optical semiconductor device 100 to be brought into contact therewith. <P>COPYRIGHT: (C)2004,JPO |
