| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device and method for plasma treatment, by which inconvenience which occurs when a dielectric film exists on an electrode upon which a DC voltage for electrostatic attraction is impressed can be eliminated, while abnormal discharges, such as DC discharge etc., are suppressed. <P>SOLUTION: The plasma treatment device, which performs plasma treatment on a dielectric substrate G to be treated, is provided with the electrode 4 on which the substrate G is placed directly, a pressing mechanism 7 which presses the peripheral edge of the substrate G placed on the electrode 4 toward the electrode 4, and a treatment gas supplying mechanism 19 which supplies a process gas to the periphery of the substrate G. The treatment device is also provided with a plasma-generating means 26, which generates a plasma of the process gas in the periphery of the substrate G and and a DC power source 6, which is connected to the electrode 4 and impresses the DC voltage upon the electrode 4. While the pressing mechanism 7 presses the peripheral edge of the substrate G placed on the electrode 4, the substrate G is sucked to the electrode 4 by impressing the DC voltage on the electrode 4. <P>COPYRIGHT: (C)2004,JPO |
