| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an insulation film made of organic material and a multi level wiring boar using the same of which, such a problem that densification of wiring, reliability of insulation, reliability of conduction can not be satisfied, is solved. <P>SOLUTION: This is the insulated film 3 having a covered layer 2 consisted of a thermosetting resin on upper and lower faces of a liquid crystal polymer layer 1, and the liquid crystal polymer layer 1 has concavities with the diameter of 0.1-3μm and the depth of 0.05-2.5μm 1-25 with a density of pieces/10μm<SP>2</SP>in that upper and lower faces. The insulated film 3 is superior in insulation property and reliability on conductivity. <P>COPYRIGHT: (C)2004,JPO</p> |
