发明名称 MULTILAYER WIRING SUBSTRATE
摘要 <p><P>PROBLEM TO BE SOLVED: To solve a problem that it is hard to make compatible the improvement of a laser machining characteristic and the improvement of strength for a multilayer wiring substrate made of an insulating film. <P>SOLUTION: In the multilayer wiring substrate 4, a plurality of insulating films 1 with each wiring conductor 2 made of metallic foil in between are laminated, and the upper and lower wiring conductors 2 with the insulating film 1 in between are connected electrically through a through conductor 3 formed in the insulating film 1. In the insulating film 1, each covering layer 6 made of liquid crystal polymer fiber combined by a polyphenylene ether-based organic material is formed on the upper and lower faces of the liquid crystal polymer layer 5. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004055929(A) 申请公布日期 2004.02.19
申请号 JP20020213100 申请日期 2002.07.22
申请人 KYOCERA CORP 发明人 KAMOI SHIGERU
分类号 H05K1/02;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/02
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