| 摘要 |
PROBLEM TO BE SOLVED: To keep the interior of a package for packaging a semiconductor chip airtight and efficiently radiate heat from the semiconductor chip to the outside. SOLUTION: A package for semiconductor chip packaging comprises a substrate 1, a frame 2, and screw cramp portions 1a. The substrate 1 is substantially rectangular and made of metal and has on its upper principal surface a placement portion 1d on which a semiconductor chip 5 is to be placed. The frame 2 is ceramic and is bonded to the peripheral portion of the upper principal surface of the substrate 1 so that the placement portion 1d is encircled with the frame. The screw cramp portions 1a have a narrowed base and are formed and protruded at two diagonal corners of the substrate 1 so that they are outside the areas sandwiched between the extensions of two adjacent sides of the substrate 1. Thus, screw holes in the screw cramp portions are positioned outside the frame 2. With respect to the substrate 1, the dimension of its upper principal surface are smaller than the outer circumference of the lower face of the frame 2 and larger than the inner circumference of the lower face of the frame 2. COPYRIGHT: (C)2004,JPO
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