发明名称 METHOD OF MEASURING PACKED CONDITION
摘要 PROBLEM TO BE SOLVED: To grasp a packed condition of a filling material using an ultrasonic wave before the filling material is cured, in execution of a foundation for arranging a base isolation device or the like. SOLUTION: The pulse (ultrasonic wave) is emitted toward a direction of concrete 8 filled in an under face of a base plate 5, the pulse reflected by the concrete 8 is received again by a probe, a defect part such as a void is thereby measured, and the concrete 8 is replenished to fill the void when the defect part such as the void is measured. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004053376(A) 申请公布日期 2004.02.19
申请号 JP20020210332 申请日期 2002.07.19
申请人 TAISEI CORP;JUST 发明人 ISHIDO SHUJI;KAMEDA RYUKICHI;TERAUCHI RIEKO;IKEGAYA YASUSHI;ISHII HIROYUKI
分类号 E04G21/06;G01N29/04;(IPC1-7):G01N29/10 主分类号 E04G21/06
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