| 摘要 |
The invention relates to laser hard soldering involving the use of a process gas, during which the process gas encloses the laser beam. To this end, the process gas advantageously flows out of a process gas nozzle (1) and surrounds the laser beam (2), which liquefies the solder (3) at the soldered junction of the components to be joined (5). Helium, argon and/or nitrogen, in particular, are suited for use as process gas. The inventive method is used, in particular, for soldering aluminum and aluminum alloys and for joining heterogeneous compounds. |
