发明名称 |
Structure and method of stacking multiple semiconductor substrates of a composite semiconductor device |
摘要 |
A structure and method of stacking multiple semiconductor substrates of a composite semiconductor device are disclosed. The structure and method of stacking multiple semiconductor substrates of a composite semiconductor device can align the semiconductor substrates when stacking and bonding the semiconductor substrates after fabricating two or more semiconductor devices of the composite semiconductor device onto the semiconductor substrates.
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申请公布号 |
US2004032017(A1) |
申请公布日期 |
2004.02.19 |
申请号 |
US20020331023 |
申请日期 |
2002.12.27 |
申请人 |
HAN IL-SEOK |
发明人 |
HAN IL-SEOK |
分类号 |
H01L25/00;H01L21/98;H01L23/544;H01L25/065;(IPC1-7):H01L23/02;H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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