| 摘要 |
PURPOSE: To lower adverse effect of noise on an IC by giving capacity to a package and realize reduction in size and cost of an electronic apparatus. CONSTITUTION: This semiconductor device comprises the IC chip 2, a frame 3 loading the IC chip 2, a conductive plate 3a allocated keeping a constant interval from the frame 3, the first external terminal 6a and the second external terminal 6b for electrically connecting the IC chip 2, frame 3 and conductive plate 3a, and a mold resin 8 for covering and sealing the IC chip 2, frame 3 and conductive plate 3a. |
