发明名称 RESIN DISCHARGE DEVICE AND MANUFACTURING APPARATUS FOR SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To keep the discharge amount of a resin constant even if the repeating dripping speed of the resin is raised. SOLUTION: A plunger barrel 13 is rotationally moved to superpose the cylinder 13a of the plunger barrel 13 on the suction hole 12b of a barrel support 12 and a plunger 15 is raised within the cylinder 13 to draw the resin in the cylinder 13a through a suction hole 12b. Succeedingly, the plunger 13 is rotationally moved to superpose the cylinder 13a on the discharge hole 12a of the barrel support 12 and the plunger 15 is pushed down in the cylinder 13a to discharge and drip the resin from the cylinder 13a through the discharge hole 12a and a discharge needle 14. Since the inner diameter r1 of the cylinder 13a, the inner diameter r2 of the discharge hole 12a of the barrel support 12 and the inner diameter r3 of the discharge needle 14 are equal, the resin flows rapidly. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004050013(A) 申请公布日期 2004.02.19
申请号 JP20020209829 申请日期 2002.07.18
申请人 SHARP CORP 发明人 ODA HIROKI
分类号 B05C5/00;H01L21/56;(IPC1-7):B05C5/00 主分类号 B05C5/00
代理机构 代理人
主权项
地址