| 发明名称 |
Method for forming metal contacts on a substrate |
| 摘要 |
Metal traces and solder bump pads are formed on a semiconductor substrate by way of a semiconductor template that has been micromachined to receive solder paste material. The solder paste material is then formed into precisely controlled ball shapes and metal trace geometries. |
| 申请公布号 |
US2004031145(A1) |
申请公布日期 |
2004.02.19 |
| 申请号 |
US20030639348 |
申请日期 |
2003.08.12 |
| 申请人 |
AKRAM SALMAN |
发明人 |
AKRAM SALMAN |
| 分类号 |
H01L21/60;H01L21/68;H05K3/34;(IPC1-7):H05K1/16;H05K1/11 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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