| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a process for producing a substrate, having a terminal electrode exhibiting a high bonding strength to a bonding wire and solder and a strength sufficient for enduring flip-chip mounting. <P>SOLUTION: On a underlying layer of Cu, or the like, formed on a substrate body, an Ni film or an Ni alloy film, a Pd film or a Pd alloy film, and an Au film are deposited sequentially and then heat treated at 200-300°C, for not longer than 120 sec, thus alloying the Pd film or the Pd alloy film and the Au film. <P>COPYRIGHT: (C)2004,JPO |
