| 摘要 |
A polishing pad for polishing the surfaces of work pieces such as semiconductor silicon wafers. The polishing pad 11 is formed of a large number of resin polishing elements 11, all tubular with a minute diameter, inseparably bound together, outer peripheral surface to outer peripheral surface, with the axial direction tube end faces aligned on a plane 1a, to form a plate structure 10 with two kinds of pores 12,13 regularly positioned, and running through the plate structure 10 in the thickness direction. The pad surface 1a of the polishing pad 11 is formed with the axial direction tube end faces of polishing elements 11. A first pore 12 is the centre bore in the polishing element 11. A second pore 13 is formed between the outer peripheral surfaces of the polishing elements 11. <IMAGE> |
