| 摘要 |
PURPOSE: An air probe card is provided to be capable of preventing the damage of a wafer pad by jetting air at the upper portion of each contact pin of the probe card. CONSTITUTION: An air probe card is provided with a main PCB(Printed Circuit Board)(20) located at the upper portion, a contact pin fixing plate(21) located at the lower portion, an upper and lower connecting plate located between the main PCB and the contact pin fixing plate for supplying air, and a plurality of contact pins(23) capable of moving up and down at the contact pin fixing plate. Lower contact pads(31) formed at the lower portion of the main PCB are connected with each contact pin through a soft contact pin connecting wire(33). The contact pin fixing plate includes through holes(34) and guide holes(35) formed at the upper portion of each through hole. The upper and lower connecting plate is thickly formed into a band shaped structure for forming an air chamber.
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