| 摘要 |
A pressure sensitive adhesive sheet for wafer sticking, comprising a base of polyvinyl chloride containing a plasticizer and, superimposed thereon, an energy radiation curable pressure sensitive adhesive layer, the energy radiation curable pressure sensitive adhesive layer, before exposure to energy radiation, having an elastic modulus ranging from 4.0x104 to 5.0x106 Pa at 50° C. The use of this pressure sensitive adhesive sheet for wafer sticking enables inhibiting the vibration of wafer at the time of dicing of the wafer so that chipping of the wafer can be minimized. |
