| 摘要 |
PURPOSE: A semiconductor package and a semiconductor package mounting method are provided to be capable of increasing mounting degree by oppositely arraying outer terminals. CONSTITUTION: The first semiconductor package(10A) is mounted at the upper portion of the second semiconductor package(10B). At this time, a plurality of outer terminals(16) are arrayed at the lower portion of the first semiconductor substrate and the upper portion of the second semiconductor substrate, respectively. At the time, the outer terminals of the first and second semiconductor substrate are arrayed opposite to each other. Preferably, a PCB(Printed Circuit Board)(30) is located between the first and second semiconductor package.
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