发明名称 |
METHOD FOR PRODUCING A CONTACT SUBSTRATE, AND CORRESPONDING CONTACT SUBSTRATE |
摘要 |
The invention relates to a method for producing a contact substrate ( 10 ) as well as to a contact substrate with through-plating between a connector arrangement ( 21 ) arranged at the top of a dielectric carrier substrate ( 12 ) and the underside of the carrier substrate, wherein the connector arrangement extends along an aperture margin ( 22 ) of a substrate recess ( 15 ), and the underside ( 11 ) of the carrier substrate ( 12 ) is supported by a backstop ( 23 ), wherein a formed solder material part ( 24 ) is placed in the substrate recess ( 15 ), and in a subsequent method-related step said formed solder material part ( 24 ) is deformed within the substrate recess so as to form a formed contact part ( 50 ), such that radial displacement of the material of the formed solder material part in the substrate recess results in a non-positive connection between an intrados surface ( 28 ) of the substrate recess and the connector arrangement ( 21 ), and that the formed contact part provides through-plating between the connector arrangement ( 21 ) and the underside ( 11 ) of the carrier substrate. |
申请公布号 |
EP1389407(A1) |
申请公布日期 |
2004.02.18 |
申请号 |
EP20020747159 |
申请日期 |
2002.05.22 |
申请人 |
PAC TECH - PACKAGING TECHNOLOGIES GMBH;SMART PAC GMBH TECHNOLOGY SERVICES |
发明人 |
ZAKEL, ELKE;AZDASHT, GHASSEM |
分类号 |
H01L21/44;H05K3/34;H05K3/40;(IPC1-7):H05K3/40 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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