| 摘要 |
An overmolded circuit board assembly and a method for forming the assembly. The assembly and method entail overmolding both surfaces of a circuit board and underfilling at least one surface-mount circuit device attached to at least one surface of the board with solder bump connections, with the result that the circuit device is spaced above the surface of the circuit board so as to define a gap therebetween. A cavity, such as a blind hole or closed through-hole, is defined in the surface of the circuit board beneath the circuit device and communicates with the gap but is closed off from the opposite surface of the circuit board. Air that is trapped in the gap by a molding material during the overmolding/underfilling process is collected and compressed within the cavity, yielding a void-free underfill between the circuit board and circuit device.
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