Method of fabricating a substrate-based semiconductor package without mold flash

摘要

A method is proposed for fabricating a substrate-based semiconductor package without mold flash. The proposed method is characterized by the provision of one or more dummy traces between each overly-spaced pair of signal traces that might cause mold flash in subsequent molding process, so that the solder mask covering over these traces can be made substantially planarized in its top surface without the undesired forming of a recessed portion that would otherwise cause leakage of molding material to the outside of the molding region during molding process. Owing to the provision of these dummy traces, no leakage hole would exist between the molding tool and the solder mask, thus preventing mold flash. The proposed method therefore allows the finished semiconductor package to be more assured in quality.