| 摘要 |
A polymeric compound of the invention includes at least one monomer unit selected from the following formulae (I), (II), (III) and (IV):(wherein R<1 >is a hydrogen atom or a methyl group, R<2 >and R<3 >are each a hydrogen atom, a hydroxyl group or a -COOR<4 >group, where R<4 >is, e.g., a t-butyl group or a 2-tetrahydropyranyl group; R<5 >and R<6 >are each a hydrogen atom, a hydroxyl group or an oxo group; R<7>, R<8 >and R<9 >are each a hydrogen atom or a methyl group; R<10 >and R<11 >are each a hydrocarbon group having 1 to 8 carbon atoms; R<12>, R<13 >and R<14 >are each a hydrogen atom, a hydroxyl group or a methyl group, where if all of R<12 >to R<14 >are each a hydrogen atom or a hydroxyl group, R<10 >and R<11 >are not coincidentally methyl groups) [wherein, when the compound includes, for example, a monomer unit of Formula (III), the compound further includes at least one monomer unit selected from among, for example, a monomer unit represented by the following Formula (V):(wherein R<15 >and R<16 >are each a hydrogen atom, a hydroxyl group or a carboxyl group; R<17 >is a hydroxyl group, an oxo group or a carboxyl group; and R<1 >has the same meaning as defined above)]. This polymeric compound has high etching resistance, as well as satisfactory transparency, alkali-solubility and adhesion, and is therefore useful as a photoresist resin.
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