发明名称 Method for manufacturing a substrate-for-wiring/ wiring harness
摘要 Method for manufacturing a wiring harness or a substrate for wiring wherein the wiring diagram applied to the substrate is based on the wiring harness information. Entities representing connectors, binding parts, and wiring length information of wirings are input. The wiring arrangement diagram includes lines that correspond to the wirings and do not have a length corresponding to actual length of the wirings. The wiring harness is made using the information including total length of wiring between each of the connectors, harness information generated based on the entities, and the length information of the desired wiring arrangement. Alternatively, the wiring harness information is used to draw a wiring diagram for fixing on the substrate.
申请公布号 US6694203(B2) 申请公布日期 2004.02.17
申请号 US20020115468 申请日期 2002.04.02
申请人 J.S.T. MFG. CO., LTD. 发明人 WADA AKIO;SHIMIZU KANEYOSHI
分类号 H01R43/28;(IPC1-7):G06F19/00 主分类号 H01R43/28
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