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发明名称
半导体积体电路
摘要
于功能块11内之元件发生不适合时,可用备用元件群12中之代用备用元件解决之,各该功能块11则系配置于该备用元件群块12之周围者。
申请公布号
TW200402865
申请公布日期
2004.02.16
申请号
TW092117360
申请日期
2003.06.26
申请人
丰田自动织机股份有限公司;新泻精密股份有限公司
发明人
宫城弘
分类号
H01L23/50
主分类号
H01L23/50
代理机构
代理人
何金涂;何秋远
主权项
地址
日本
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