| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing sheet and a polishing pad, which can effectively suppress the generation of scratches, and further to provide a foam element to be used for the polishing sheet and the polishing pad and its manufacturing method, and a method for manufacturing a semiconductor device. <P>SOLUTION: The method is used to manufacture a foam element for a polishing sheet to be used in chemical-mechanical polishing. At least a process for measuring materials, a mixing process, a foaming process, a pouring process, and a hardening process are carried out in the ambience where particulates larger than 0.3 μm are fewer than 1000/ft<SP>3</SP>. <P>COPYRIGHT: (C)2004,JPO |
