LID FOR SEALING PLATE TYPE SUBSTRATE AND ITS MANUFACTURING METHOD

摘要

PURPOSE: To provide a cap type lid having a strong solder joint and a satisfactory sealing property with no flange, and to provide its manufacturing method. CONSTITUTION: The cap type lid is shaped in square in its top face with a side wall continuously formed from the top face and the soldering part of the lower end of the side wall is bent to project outside by 10 to 500 μm. The adhesion of solder on the back side of the lid completely solders a bent soldering part to the plate board by soldering with the lid mounted on the plate board. After forming an emboss by squeeze tooling a solder adhered, on one side, belt metal, the lid is obtained by cutting the flat part of the belt metal from the bent part formed by the emboss.