LASER REPAIR EQUIPMENT FOR SEMICONDUCTOR DEVICE

摘要

PURPOSE: Laser repair equipment for a semiconductor device is provided to avoid a wafer slip and prevent a wafer from being broken when the wafer is loaded/unloaded into/from a chuck by having a chuck pin that includes a chuck pin body and a chuck pin cap of a great friction coefficient. CONSTITUTION: The chuck pin(220) loads/unloads the wafer into/from the chuck in a semiconductor device laser repair process during a semiconductor post process in which a redundancy cell is replaced by an electrically damaged cell of a semiconductor device on the wafer. The chuck pin body(222) is prepared. The chuck pin cap(224) supports the wafer, located in the upper portion of the chuck pin and made of a material having a friction coefficient greater than that of a material constituting the chuck pin body.