| 摘要 |
PURPOSE: A connection method of an integrated circuit to a substrate is provided to be capable of reducing costs and simplifying process. CONSTITUTION: A main area of an integrated circuit(1) is provided, wherein the integrated circuit includes an electrical contacting region(2) and a mechanical supporting structure(3a,3b) with a solderable surface region(5a,5b). A solderable terminal region(10) electrically connected to the electrical contacting region(2) is formed on the main area of the integrated circuit(1). A main area of a substrate(20) is provided, wherein the substrate includes a first soldering region(22',23') which can be aligned with the solderable surface regions(5a,5b) and a second soldering region(22,23) which can be aligned with the solderable terminal region(10). The surface regions(5a,5b) and the terminal region are simultaneously soldered to the first soldering region(22',23') and the second soldering region, respectively. |
